The 5th GMIF Innovation Summit, also called the Global Memory Innovation Forum 2026, was held at the Renaissance Shenzhen Bay Hotel in Shenzhen. It was co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University. The association said the theme was "The Future Built on AI Memory and Storage," and that the token economy was a key perspective for looking at new trends, demands and partnerships in the AI era.
The summit set up the GMIF2026 Annual Awards across memory and storage, compute, packaging and testing equipment, test systems and end applications. Winners were assessed on technology innovation, industry contribution, market service and application results. The association said the list of honorees traces the technology roadmap of the memory and storage industry in the era of large models.
Among the winners, Samsung Semiconductor took the Outstanding AI Memory & Storage Industry Leadership Award, Sandisk the Outstanding NAND Technology Breakthrough Award, Solidigm the Outstanding AI SSD Technology Innovation Award and CXMT the Outstanding DRAM Technology Innovation Award. Arm received the Outstanding AI Computing Ecosystem Contribution Award and Lenovo the Outstanding AI Infrastructure Leadership Award. Other awards went to Dify for an open-source platform, Silicon Motion for controller technology, Numbers Law for HDD technology, Paratera for AI computing services, SYNCORE for intelligent cockpit technology, NEXWISE as an AI infrastructure pioneer and Maxio Technology for its AI storage ecosystem.
A second group recognised solution providers: BIWIN for enterprise memory and storage, Infplane for intelligent storage, Genstoraige as an emerging enterprise in AI storage innovation, Topdisk for market potential, KingSpec for storage testing innovation, POWEV for brand innovation, Quanxing Technology for AI infrastructure services and Barycn as an emerging memory and storage brand.
A third group covered supply chain companies in packaging and testing, equipment, materials and power management, among them OKN Technology, APIE, COMIX, LKAUTO, Maxwell Technologies, Hemei Jingyi, Silergy, Heyan Technology, ExTripod Electronics, UNIMOS, GBAT and Tytantest.
