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E&R Engineering to open Malaysian packaging materials plant on Oct. 13

The Taiwanese semiconductor packaging equipment maker says the Melaka facility will begin mass production early next year and hire 50 local workers.

E&R Engineering to open Malaysian packaging materials plant on Oct. 13

E&R Engineering Corp. (TWSE: 8027) will hold the grand opening of its Malaysian subsidiary, E&R SEMICONDUCTOR (MALAYSIA) SDN. BHD., at the Melaka Free Trade Zone on October 13, the company said.

The company said it is moving part of its packaging materials production focus to Malaysia while expanding overall capacity, responding to what it described as rising demand in Southeast Asia. Its plant in China continues to see steady business growth, it said. The new site is undergoing sample testing and qualification, with mass production set to start early next year, and is expected to create 50 local jobs.

The plant is located in Phase III of the Batu Berendam Free Trade Zone in Melaka and will produce high-end embossed carrier tapes and cover tapes locally. According to the company, the facility shortens lead times and offers precision, electrostatic discharge protection and packaging interfaces intended to support advanced packaging trends including chip miniaturization and chiplet integration.

E&R President KS Chen said the site will also serve as a local hub for the company's semiconductor equipment field service engineers, with a focus on hiring local talent and building a specialized equipment engineering team for localized technical support and after-sales service. AK Ong, general manager of the Malaysia plant, said the facility allows the company to work closer to customers and provide real-time support.