The IC Ecosystem Show (ICES 2026) will take place from October 12 to 16, 2026, in Hall 5.2 at the National Exhibition and Convention Center in Shanghai, the organisers said. The event is one of the theme shows of the 26th China International Industry Fair (CIIF 2026). According to the organisers, it will gather semiconductor companies, technology innovators, equipment suppliers and industrial end-users.
The organisers said the exhibition is organised around real-world industrial applications rather than by product category alone, and that the technologies on show were selected for industrial-grade reliability, automotive-grade compliance, and AI and embodied AI applications. They said the event connects the value chain from design and wafer fabrication through advanced packaging and equipment to downstream system integration.
Five exhibition zones are planned. The Integrated Circuit Design Zone covers EDA tools and platforms, IP cores, IC design services and core chip solutions including HPC processors, memory chips, power management ICs and power semiconductors. The Wafer Fabrication Zone covers logic and specialty process platforms, IDM and memory manufacturing, compound semiconductor manufacturing and smart fab facilities. The Packaging & Testing Zone covers advanced packaging such as wafer-level packaging and system-in-package, packaging for automotive electronics and MEMS, inspection and analysis, and processes including glass substrates. The Semiconductor Equipment & Materials Zone covers wafer fab equipment such as lithography, etching, thin-film deposition, cleaning and CMP, along with metrology and inspection systems, compound-semiconductor tools, silicon wafers, photoresists, electronic specialty gases and subsystems. The Application & System Integration Zone covers chip and embedded solutions for embodied AI, intelligent vehicles, smart home appliances and wearable electronics, the organisers said.
Alongside the exhibition, the organisers said ICES 2026 will host a conference programme in three tiers: a main industry summit, more than 10 specialised technical forums and executive networking events. Government officials, industry executives, technology experts and investors are expected to take part, with tracks covering automotive semiconductors, advanced memory technologies, embodied AI and industrial robotics, and next-generation IC packaging and ecosystem integration.
ICES 2026 is part of CIIF 2026, which the organisers said covers 300,000 square metres and spans the smart and sustainable manufacturing supply chain, including foundational materials, key components, manufacturing equipment and solutions. Pre-registration for CIIF 2026 and ICES is open, the organisers said.